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RoHS Lead Free
Lead-free legislation
On the 1 July 2006 the Restriction of Hazardous Substances (RoHS) directive came into effect.
The directive makes it illegal to use six substances in the manufacture of electronics, the most problematic of which is the removal of lead from solder. Without lead the properties of solder that we have taken for granted for so many years (melting point, wetting, flow etc.) change, and as a consequence so must our manufacturing processes and the components we use in them.
Datalink has made major investment in equipment and processes to support RoHS-compliant manufacture. If you need advice, please contact us.
Why the ban?
We now live in a world of consumable electronics – when a device or an appliance fails it is thrown away rather than repaired. There is concern that the large amount of scrap electronics in land-fill sites is contributing to the increased levels of toxic substances we see leaching out of these sites and into the water supply.
What is being done?
Governments around the world are putting in place legislation that restricts the use of hazardous substances in electronics. Japan has lead the way with a number of countries now following suit including the EU, America and China . In many markets it is now illegal to sell any electronic products unless they are lead-free.
What are the potential problems?
The removal of lead from solders will increase process temperatures and components will need to be certified for use at these higher temperatures. Undoubtedly component manufactures will not provide alternatives for their entire product range and some components will be made obsolete. Additionally, there may be some part number changes.
Stocks of old components may only be used for the repair of existing boards.
Lead-free solders are more expensive than their leaded counterparts. Also, there are higher energy and maintenance costs in production. Inevitably, this means higher product costs.
Exceptions
There are certain product ranges that have been exempted from compliance. Primarily, these are for the military and medical markets. The directive does need to be studied to see whether your product is exempt.
Consequences
The Electronics Industry is moving to lead-free manufacture. If your product is to be sold in the EU it must be RoHS-compliant.
Full turnkey solution
Datalink's full turnkey solutions encompass:
- Design and product engineering
- Component procurement
- Stock control and warehousing
- Production
- Quality control and test
- Packaging and dispatch
At Datalink we believe that total turnkey provision means supplying added manufacturing value. Over time this leads to a sustained service relationship with our clients
As the pace of change accelerates, many manufacturers accept they cannot be saddled with the complications of building an infrastructure for the non-core parts of their business.
As customers demand higher quality, companies appreciate the valuable contribution contract manufacturers can offer in specialist manufacturing - especially the role that a total turnkey manufacturer can make to business flows.
By contracting some or all of their electronic manufacturing, OEMs can focus on core skills, allowing them to concentrate on excellence of design, and maintenance of innovative manufacture.
Product design and development
Datalink will work with you, the customer, throughout the design and development process to ensure the final product is economic to produce and robust in operation.
Once requirements have been defined, we will prepare a Design Proposal Document. This gives you an early opportunity of seeing what the final product will look like and how it will perform.
Improvements and/or extensions can then be considered before progressing to more detailed design. 'Design for Manufacture' and 'Design for Test' are considered at this stage.
Datalink has a number of software tools to aid the design process, including AutoCAD for general drawing work, OrCAD Schematic Capture for circuit design and the Xilinx Integrated Synthesis Environment for FPGA development.
As design work progresses we hold regular reviews with the customer to ensure the design meets your requirements.
Design documentation, including operator's manuals, technical manuals and test procedures can be produced, as the customer requires.
Obsolescence is an on-going problem in the electronics industry. Datalink can review your designs and advise on suitable upgrade paths to remove obsolete components.
Dr Jim Allen leads the Datalink design team and has over 25 years experience in designing products and systems with specific skills in data acquisition, digital signal processing, ASIC design and high-speed digital design.
Testing
AUTOMATIC TEST EQUIPMENT (ATE)
- Teradyne Z18 60
- Marconi Midata 511
- Marconi Midata 510
- XJTAG Tools for boundary-scan testing
(click on link) www.xjtag.com
GENERAL TEST EQUIPMENT
- TTI 10MHz Function Generators
- Agilent 53131A 225MHz Universal Counters
- Agilent Network Analyser
- Tektronix 100MHz oscilloscopes
- Various Power Supplies
- Various volt, amp, capacitance meters
- Test computers
- Programmable temperature chamber -50 to +190
- Cirris Signature 1000H cable analyser
DEVICE PROGRAMMING
- ALL –11 Universal programmer
- Actel Activator 2
- Microchip MPLAB ICD2
- Altera max plus II
- Xilinx XPLA
- Xilinx impact JTAG programmer
- Lattice ISP
SMART group members since 2004
PTH Capabilities
CMS 400 Leaded Process
This Blundell machine enables Datalink Electronics to spray flux (no clean) and wave solder different size and density PCBs. Electric conveyors feed the unit with up to six loading positions and post wave solder positions.
Blundell Selective Soldering machine LEAD FREE
Selective soldering machine allows automated precise soldering to Lead Free double-sided mixed technology PCB’s.
Contact CS 740-B
The two machines are semi automatic machines used via tray auto loaders to insert and clinch through hole components into PCBs of various shapes, sizes and densities.
SMT Capabilities
Two fully automated Pick and Place lines consisting of Quad and Universal machines designed for use in high job mix environment.
- Quad Screen printers
- Quad chipshooters with a placement range of 0201 to 50mm square, full vision component placement, fitted precision head allows placement of BGA, m BGA and CSP components.
- Universal GSM 1 Fine pitch placement machines ensure repeatability of all components ranging from 0402 to BGA, m BGA and CSP components.
- Quad and BTU Reflow ovens enable accurate profiling of high mixed density PCB’s for both Leaded and Lead Free products.
Datalink has design and manufacturing approval for electronic, electrical and mechanical products to ISO9001